Work

High Aspect Ratio >10 TSV Design and Integration Challenges and Solutions for the Multi Memory Stacking

Year: 2024

Type: conference-paper

Source: IEEE Electronics Packaging Technology Conference (EPTC)

DOI: 10.1109/eptc62800.2024.10909751

Authors: Xiangyu Wang, Tran Van Nhat Anh

Institutions: Agency for Science, Technology and Research, Institute of Microelectronics

Language: English

Topic: 3D IC and TSV technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W4408324948

FWCI: 0.781

Cites: 5

Cited by: 1

Related to: 10