Work

Accelerating Bonding Overlay Error Optimization in Fine-Pitch Wafer-to-Wafer Hybrid Bonding Through Machine Learning

Year: 2024

Type: conference-paper

Source: IEEE Electronics Packaging Technology Conference (EPTC)

DOI: 10.1109/eptc62800.2024.10909765

Authors: Ashish James, Nandini Venkataraman, Ji Hong Miao, Navab Singh, Xiaoli Li

Institutions: Agency for Science, Technology and Research, Institute for Infocomm Research, Institute of Microelectronics

Language: English

Topic: 3D IC and TSV technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W4408324959

FWCI: 2.418

Cites: 8

Cited by: 3

Related to: 10