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Packaging Design and Loss Analysis of RC-IGBT and SiC MOSFET Hybrid Module

Year: 2024

Type: conference-paper

Source: IEEE Electronics Packaging Technology Conference (EPTC)

DOI: 10.1109/eptc62800.2024.10909958

Authors: Kai Zhang, Xinhua Guo, Jihong Zhu, Xiangyang Wang, Zhaodai Li, Ruipei Chen, Jinyuan Fu, Zhimeng Jin

Institutions: Huaqiao University, Tsinghua University

Language: English

Topic: Silicon Carbide Semiconductor Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDGs: Affordable and clean energy, Industry, innovation and infrastructure

Open Access status: closed

Funders: National Natural Science Foundation of China, National Key Research and Development Program of China

Awards: G1897907963, G2348414739

OpenAlex ID: W4408324985

FWCI: 0.799

Cites: 2

Cited by: 1

Related to: 10