Work

Silicone Gel Filled Power Module for Harsh Environment Applications: A Case Study on the Gel and Case Material Interaction

Year: 2024

Type: conference-paper

Source: IEEE Electronics Packaging Technology Conference (EPTC)

DOI: 10.1109/eptc62800.2024.10909775

Authors: Muhammad Ashraf Zainudin, Shutesh Krishnan, Muhammad Shafiq Sukiman, Noahbel Callado

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W4408324993

FWCI: 0.806

Cites: 4

Cited by: 1

Related to: 10