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A Study on Thermal Performance Enhancement for Multi-Chip Power µModules

Year: 2024

Type: conference-paper

Source: IEEE Electronics Packaging Technology Conference (EPTC)

DOI: 10.1109/eptc62800.2024.10909955

Authors: Qiaobo Dai, Zhen Liu, Linjie Liao, Boyu Zheng, Zheng Liu, Sheng Yuan

Institution: Central South University

Language: English

Topic: Heat Transfer and Optimization

Subfield: Mechanical Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4408325000

FWCI:

Cites: 5

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Related to: 10