Work

Determination of the Adhesive Strength of Monocrystalline Layers as a Thin Film on a Silicon Substrate by Means of Instrumented Indentation Testing

Year: 2024

Type: conference-paper

Source: IEEE Electronics Packaging Technology Conference (EPTC)

DOI: 10.1109/eptc62800.2024.10909930

Authors: Jan Albrecht, Sven Rzepka

Institution: Fraunhofer Institute for Electronic Nano Systems

Language: English

Topic: Metal and Thin Film Mechanics

Subfield: Mechanics of Materials

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4408325008

FWCI:

Cites: 15

Cited by:

Related to: 10