Work

Low Temperature Ag Sintering and Driving Force on Au Finished Cu Substrates at 145°C and 175°C Using Ag Nano-Porous Sheets without Organic Solvents

Year: 2024

Type: conference-paper

Source: IEEE Electronics Packaging Technology Conference (EPTC)

DOI: 10.1109/eptc62800.2024.10909821

Authors: YehRi Kim, Ha-Young Yu, Seungjun Noh, Dongjin Kim

Institutions: Korea Institute of Industrial Technology, Hyundai Mobis (South Korea)

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4408325010

FWCI:

Cites: 12

Cited by:

Related to: 10