Work

A Comprehensive Simulation Study on Cu Trace Damage and Cu/Polyimide Interface Delamination of RDLs in Fan-Out Wafer Level Package Under Hygro-Thermo-Mechanical Loads

Year: 2024

Type: conference-paper

Source: IEEE Electronics Packaging Technology Conference (EPTC)

DOI: 10.1109/eptc62800.2024.10909933

Authors: Ming-Sheng Luo, Guang-Chao Lyu, Jia-Wei Deng, Xin-Ping Zhang

Language: English

Topic: 3D IC and TSV technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

Funder: National Natural Science Foundation of China

Award: G7129027855

OpenAlex ID: W4408325023

FWCI: 1.557

Cites: 17

Cited by: 2

Related to: 10