Work

Study of Die Attach Epoxy Materials and Properties Affecting Substrate Trace Cracks

Year: 2024

Type: conference-paper

Source: IEEE Electronics Packaging Technology Conference (EPTC)

DOI: 10.1109/eptc62800.2024.10909944

Authors: Jasmine Lim, Stephen Lee, Ryan Zhang, Hai Yan Liu

Institution: NXP (United States)

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4408325036

FWCI: 1.557

Cites: 3

Cited by: 2

Related to: 10