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Versatile Photosensitive Polymer Applied in Low-Temperature Hybrid Bonding with Nanocrystalline Cu

Year: 2024

Type: conference-paper

Source: IEEE Electronics Packaging Technology Conference (EPTC)

DOI: 10.1109/eptc62800.2024.10909808

Authors: Chung-An Tan, Chia-Hsin Lee, Ou-Hsiang Lee, Wei-Lan Chiu, Hsiang-Hung Chang, Shih-cheng Yu

Institutions: Brewer Science (United States), ITRI International, Industrial Technology Research Institute

Language: English

Topic: 3D IC and TSV technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4408325039

FWCI:

Cites: 9

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Related to: 10