Work

Strain Rate-Dependent Interface Characterization for Pad Cratering Failure Study

Year: 2024

Type: conference-paper

Source: IEEE Electronics Packaging Technology Conference (EPTC)

DOI: 10.1109/eptc62800.2024.10909906

Authors: Jiasheng Huang, Ke Xue, Dong Lu, Renjie Wang, Weiquan Luo, Richeng Liu

Institutions: Hong Kong University of Science and Technology, The Hong Kong University of Science and Technology (Guangzhou), Guangzhou HKUST Fok Ying Tung Research Institute

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

Funders: Guangdong Science and Technology Department, Guangzhou Municipal Science and Technology Bureau

Awards: G5907438871, G7657972697

OpenAlex ID: W4408325060

FWCI:

Cites: 18

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Related to: 10