Work

Use of AI to Predict Compatibility Between Solder Paste Residues and Coatings

Year: 2024

Type: conference-paper

Source: IEEE Electronics Packaging Technology Conference (EPTC)

DOI: 10.1109/eptc62800.2024.10909966

Authors: Mélanie Mathon, Mehdi Guelmoussi

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W4408325062

FWCI: 0.779

Cites:

Cited by: 1

Related to: 10