Work

Hyperspectral Component Fabrication on 200mm CMOS Image Sensor Wafer

Year: 2024

Type: conference-paper

Source: IEEE Electronics Packaging Technology Conference (EPTC)

DOI: 10.1109/eptc62800.2024.10909929

Authors: Tina Babu Shylaja, Tae Jin Yoo, Bert Geelen, Klaas Tack, Deniz Sabuncuoglu Tezcan

Institution: IMEC

Language: English

Topic: CCD and CMOS Imaging Sensors

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4408325064

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Cites: 3

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Related to: 10