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BLR Drop Test Study for FCCSP Package with OSP/Cu Solder Pad finish

Year: 2024

Type: conference-paper

Source: IEEE Electronics Packaging Technology Conference (EPTC)

DOI: 10.1109/eptc62800.2024.10909876

Authors: J.M Liu, Rongrong Jiang, J. ZYao, Harry Gan, Xingshou Pang

Institution: NXP (Germany)

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4408325066

FWCI:

Cites: 7

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Related to: 10