Work

An Optimization Study with Batch Microwave Plasma was Done on Extra-Wide Leadframe Size to Achieve a Robust Result Against Delamination

Year: 2024

Type: conference-paper

Source: IEEE Electronics Packaging Technology Conference (EPTC)

DOI: 10.1109/eptc62800.2024.10909816

Authors: Shei Meng Loo, Federico Leone, Nohora Caicedo

Institution: STMicroelectronics (Singapore)

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4408325102

FWCI:

Cites: 11

Cited by:

Related to: 10