High-Speed Interconnect Transmission Structure Design and Optimization in 3D Integrated System
Year: 2024
Type: conference-paper
Authors: Cun-Long Li, Zhen-Song Li, Cheng-Hao Yuan
Institution: Beijing Information Science & Technology University
Language: English
Topic: 3D IC and TSV technologies
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
OpenAlex ID: W4408325104