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An Innovative Flux-Less Solder Ball Attachment Technology (FLAT) for Advanced BGA Assembly

Year: 2024

Type: conference-paper

Source: IEEE Electronics Packaging Technology Conference (EPTC)

DOI: 10.1109/eptc62800.2024.10909973

Authors: Dongjin Kim, Seonghui Han, Sang Eun Han, Dong-Gyu Choi, Kwansik Chung, Eunchae Kim, Sehoon Yoo

Institution: Korea Institute of Industrial Technology

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4408325262

FWCI:

Cites: 3

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Related to: 10