Work

Robustness Methodology for Next Generation Automotive Microcontroller Flip Chip Copper Pillar Technologies

Year: 2024

Type: conference-paper

Source: IEEE Electronics Packaging Technology Conference (EPTC)

DOI: 10.1109/eptc62800.2024.10909828

Authors: Tan Aik Chong, Bauer Robert, Rau Ingolf, Doering Inga, Niessner Martin, Soric Mario

Institutions: Infineon Technologies (Singapore), Infineon Technologies (Germany)

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W4408325269

FWCI:

Cites: 12

Cited by:

Related to: 10