Work

Process Optimization to Improve Electrical Performance of Aluminum Filled Via-Last TSV for BSI Applications

Year: 2024

Type: conference-paper

Source: IEEE Electronics Packaging Technology Conference (EPTC)

DOI: 10.1109/eptc62800.2024.10909964

Authors: Jun Wei Javier Ong, Ting Ta Chi, Jae Ok Yoo, Hong Yu Li

Institutions: Agency for Science, Technology and Research, Institute of Microelectronics

Language: English

Topic: 3D IC and TSV technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W4408325273

FWCI:

Cites: 6

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Related to: 10