Work

Influence of Material Composition on Copper-Aluminum Wire Bonding Reliability

Year: 2024

Type: conference-paper

Source: IEEE Electronics Packaging Technology Conference (EPTC)

DOI: 10.1109/eptc62800.2024.10909956

Authors: Roberta Carluccio, Carolina Caglio, Mirko Alesi, Alberto Mancaleoni, Riccardo Villa, Andrea Serafini, David Dellasega

Institutions: STMicroelectronics (Italy), Politecnico di Milano

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4408325276

FWCI: 0.806

Cites: 6

Cited by: 1

Related to: 10