Work

Impact of Structural Parameters on the Warpage of fcBGA Packages with Indium Thermal Interface Material

Year: 2024

Type: conference-paper

Source: IEEE Electronics Packaging Technology Conference (EPTC)

DOI: 10.1109/eptc62800.2024.10909911

Authors: Zhen Liu, Qiaobo Dai, Linjie Nie, Lanying Xu, Xiaodong Teng, Boyu Zheng

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4408325277

FWCI: 0.804

Cites: 14

Cited by: 1

Related to: 10