Work

Adaptive Pad Stacks Delivering an Order of Magnitude Increase in Bridge Die Position Tolerance in Embedded Fan-out Interposers

Year: 2024

Type: conference-paper

Source: IEEE Electronics Packaging Technology Conference (EPTC)

DOI: 10.1109/eptc62800.2024.10909889

Authors: Clifford Sandstrom, Erick Talain, Benedict San Jose, Jen-Kuang Fang, Ping-Feng Yang, Sheng-Feng Huang, Ping-Ching Shen

Institution: Advanced Semiconductor Engineering (Taiwan)

Language: English

Topic: 3D IC and TSV technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W4408325279

FWCI: 0.806

Cites: 5

Cited by: 1

Related to: 10