Work

Surface Quality Challenges Associated with Temporary Bonding and Debonding Process for Chip Stacking Applications

Year: 2024

Type: conference-paper

Source: IEEE Electronics Packaging Technology Conference (EPTC)

DOI: 10.1109/eptc62800.2024.10909924

Authors: Sangita Chaki Roy, Nandini Venkataraman, Vasarla Nagendra Sekhar

Institutions: Agency for Science, Technology and Research, Institute of Microelectronics

Language: English

Topic: 3D IC and TSV technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4408325282

FWCI: 0.806

Cites: 10

Cited by: 1

Related to: 10