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Wire Sweep Optimization with Mold Process Simulation (Virtual DoE)

Year: 2024

Type: conference-paper

Source: IEEE Electronics Packaging Technology Conference (EPTC)

DOI: 10.1109/eptc62800.2024.10909788

Authors: Subramanian N. R., Cando Rogelio, Lim Shaw Fa, Quah Siew Eng.

Institution: Infineon Technologies (Singapore)

Language: English

Topic: Injection Molding Process and Properties

Subfield: Mechanical Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W4408325289

FWCI:

Cites: 2

Cited by:

Related to: 10