Work

Advantages of Digital Lithography in Patterning of UHD FOWLP Utilizing Novel PI Dielectrics

Year: 2024

Type: conference-paper

Source: IEEE Electronics Packaging Technology Conference (EPTC)

DOI: 10.1109/eptc62800.2024.10909856

Authors: K. Varga, R. Holly, T. Zenger, B. Považay, T. Uhrmann, Y. C. Kuo, Y. Y. Lee, M. Vandevyvere, M. Reybrouck, N. Van Herck, D. Janssen, S. Vanclooster, L. C. Chang, T. Y. Ouyang, H. H. Chang, C. H. Wang

Institutions: EV Group (Austria), Fujifilm (Japan), Industrial Technology Research Institute

Language: English

Topic: Advancements in Photolithography Techniques

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W4408325290

FWCI:

Cites: 3

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Related to: 10