Work

A New D2W Bonding Alignment Scheme Using Magnetic and Capillary Assisted Self-Alignment

Year: 2024

Type: conference-paper

Source: IEEE Electronics Packaging Technology Conference (EPTC)

DOI: 10.1109/eptc62800.2024.10909813

Authors: Daesan Choi, Sumin Kim, Il Young Han, Seung Ho Hahn, Bumki Moon, Daniel Minwoo Rhee

Institutions: Samsung (South Korea), Samsung Electronics (South Korea)

Language: English

Topic: 3D IC and TSV technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4408325294

FWCI:

Cites: 12

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Related to: 10