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The UV Tape with Excellent Adhesion Property for Die to Wafer (D2W) Hybrid Bonding

Year: 2024

Type: conference-paper

Source: IEEE Electronics Packaging Technology Conference (EPTC)

DOI: 10.1109/eptc62800.2024.10909857

Authors: Yu Zhang, Fei Ding, Renxi Jin, Yudong Yang, Qidong Wang

Institutions: Chinese Academy of Sciences, Institute of Microelectronics

Language: English

Topic: 3D IC and TSV technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

Funder: National Natural Science Foundation of China

Award: G26003959

OpenAlex ID: W4408325295

FWCI:

Cites: 6

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Related to: 10