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Electro-Thermal-CFD Modeling for Joule Heating Analysis in Power Module

Year: 2024

Type: conference-paper

Source: IEEE Electronics Packaging Technology Conference (EPTC)

DOI: 10.1109/eptc62800.2024.10909927

Authors: Qingming Feng, Yiming Liang

Institution: STMicroelectronics (China)

Language: English

Topic: Silicon Carbide Semiconductor Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDGs: Affordable and clean energy, Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W4408325304

FWCI:

Cites: 4

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Related to: 10