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Efficient Thermal-Aware Floor-Planning with Bayesian Optimization: A Simulation-Efficient Approach

Year: 2024

Type: conference-paper

Source: IEEE Electronics Packaging Technology Conference (EPTC)

DOI: 10.1109/eptc62800.2024.10909925

Authors: Furen Zhuang, Partha Pratim Kundu, Ata Kircali Sezin, Yubo Hou, Mihai Dragos Rotaru, Rahul Dutta, Ashish James

Institutions: Agency for Science, Technology and Research, Institute for Infocomm Research, Institute of Microelectronics

Language: English

Topic: VLSI and FPGA Design Techniques

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W4408325305

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Cites: 8

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Related to: 10