Comparison of Electrical, Thermal, and Mechanical Performances of a fcBGA with that of a Fan-Out SiPlet Package
Year: 2024
Type: conference-paper
Authors: Eric Ouyang, Billy Ahn, Mica Chen, BJ Han, Michael Han, Chen Kang, Joo Yeop Kim, Michael Oh, Ingrid Wang
Institution: Silicon Motion (Taiwan)
Language: English
Topic: 3D IC and TSV technologies
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
OpenAlex ID: W4408325307