Work

Evaluation of Indium Thermal Interface Material (TIM) Cross-Sectioning Methods on Lidded High-Performance Microprocessors

Year: 2024

Type: conference-paper

Source: IEEE Electronics Packaging Technology Conference (EPTC)

DOI: 10.1109/eptc62800.2024.10909789

Authors: Neo Shao Ming, Song Mei Hui, Kevin Tan Bo Lin, Lee Xi Wen, Oh Zi-Ying, Foo Fang-Jie

Institution: Advanced Micro Devices (Singapore)

Language: English

Topic: Integrated Circuits and Semiconductor Failure Analysis

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W4408325310

FWCI:

Cites: 7

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Related to: 10