Work

Study of Direct Copper Electroplating on Ruthenium Seed Layer for Nano-TSVs Processes on 300mm Wafers

Year: 2024

Type: conference-paper

Source: IEEE Electronics Packaging Technology Conference (EPTC)

DOI: 10.1109/eptc62800.2024.10909679

Authors: Tran Van Nhat Anh, Nandini Venkataraman, Tseng Ya-Ching, Chen Zhixian

Institutions: Agency for Science, Technology and Research, Institute of Microelectronics

Language: English

Topic: 3D IC and TSV technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W4408325313

FWCI:

Cites: 7

Cited by:

Related to: 10