Work

Investigation on Molding Void Issue in System-in-Package Modules

Year: 2024

Type: conference-paper

Source: IEEE Electronics Packaging Technology Conference (EPTC)

DOI: 10.1109/eptc62800.2024.10909884

Authors: Chaoran Yang, Oscar Tang, Fubin Song

Institution: Amazon (United States)

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W4408325315

FWCI: 0.781

Cites: 12

Cited by: 1

Related to: 10