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Package Miniaturization Through Substrate Design and Assembly Process Optimization - A Product Cost Reduction Case Study

Year: 2024

Type: conference-paper

Source: IEEE Electronics Packaging Technology Conference (EPTC)

DOI: 10.1109/eptc62800.2024.10909914

Authors: Siva Sai Krishna K, Stalin SM, Rex Bayasen, Krisha Mae Daniel

Institutions: Texas Instruments (India), Texas Instruments (United States)

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W4408325324

FWCI:

Cites: 6

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Related to: 10