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Low Temperature Degradable and Reuse Technology of Semiconductor Liquid Packaging Materials

Year: 2024

Type: conference-paper

Source: IEEE Electronics Packaging Technology Conference (EPTC)

DOI: 10.1109/eptc62800.2024.10909901

Authors: Yi-Chun Chen, Yueh-Chuan Huang, Chih-Hao Lin, Kai-Chi Chen

Institution: Industrial Technology Research Institute

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDGs: Responsible consumption and production, Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W4408325328

FWCI:

Cites: 5

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Related to: 10