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Low-Loss Non-Contact Interconnects Based on 3D Heterogeneous Redistribution Layer for Millimeter Wave Phased Arrays

Year: 2024

Type: conference-paper

Source: IEEE Electronics Packaging Technology Conference (EPTC)

DOI: 10.1109/eptc62800.2024.10909980

Authors: Lichang Huang, Yuting Tong, Sha Xu, Xiaobin Xu, Jinxing Chen, Yunfei Cao

Institutions: South China University of Technology, Guangdong University of Technology

Language: English

Topic: 3D IC and TSV technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

Funder: National Natural Science Foundation of China

Award: G229929600

OpenAlex ID: W4408325330

FWCI:

Cites: 4

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Related to: 10