Work

Package Design Optimization of ED-FCCSP with Different Die Aspect Comparison to Prevent Void Issue

Year: 2024

Type: conference-paper

Source: IEEE Electronics Packaging Technology Conference (EPTC)

DOI: 10.1109/eptc62800.2024.10909915

Authors: Freedman Yen, Vito Lin, Teny Shih, Andrew Kang, Yu-Po Wang

Institution: Siliconware Precision Industries (Taiwan)

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4408325331

FWCI:

Cites: 3

Cited by:

Related to: 10