Work

Defluxing in Advanced Packaging: Critical Process Considerations and Solutions

Year: 2024

Type: conference-paper

Source: IEEE Electronics Packaging Technology Conference (EPTC)

DOI: 10.1109/eptc62800.2024.10909910

Author: Ravi Parthasarathy

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4408325332

FWCI: 0.806

Cites: 2

Cited by: 1

Related to: 10