Work

An Optical Engine with both EIC and PIC Embedded in Mold Compound in FOWLP

Year: 2024

Type: conference-paper

Source: IEEE Electronics Packaging Technology Conference (EPTC)

DOI: 10.1109/eptc62800.2024.10909939

Authors: Jia Qi wu, Teck Guan Lim, Sajay Bhuvanendran Nair Gourikutty

Institutions: Agency for Science, Technology and Research, Institute of Microelectronics

Language: English

Topic: Semiconductor Lasers and Optical Devices

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W4408325340

FWCI: 0.806

Cites: 7

Cited by: 1

Related to: 10