Work

Analysis of Basic Properties and Bonding Properties of Various Melting Temperature Solders

Year: 2024

Type: conference-paper

Source: IEEE Electronics Packaging Technology Conference (EPTC)

DOI: 10.1109/eptc62800.2024.10909920

Authors: HJ Kim, YW Lee, JM Won, JY Son, SG Lee, JW Park, BW Kim, JG Lee, JJ Shin, TK Lee

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4408325341

FWCI: 0.781

Cites: 7

Cited by: 1

Related to: 10