Work

Process Development of Chip to Wafer Hybrid Bonding with Polymer Passivation

Year: 2024

Type: conference-paper

Source: IEEE Electronics Packaging Technology Conference (EPTC)

DOI: 10.1109/eptc62800.2024.10909685

Authors: Ling Xie, Yu Shoji, Masaya Jukei, Kota Nomura, Takenori Fujiwara, Hitoshi Araki, Ser Choong Chong, Vasarla Nagendra Sekhar, Dileep Kumar Mishra, Ismael Cereno Daniel, Hipona Randy Tupaen, Vempati Srinivasa Rao

Institutions: Agency for Science, Technology and Research, Institute of Microelectronics, Toray Industries, Inc. (Japan)

Language: English

Topic: 3D IC and TSV technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W4408325348

FWCI: 0.8

Cites: 6

Cited by: 1

Related to: 10