Work

Impact of Package Warpage on Package Strength Assessment Under Three-Point Bending Test

Year: 2024

Type: conference-paper

Source: IEEE Electronics Packaging Technology Conference (EPTC)

DOI: 10.1109/eptc62800.2024.10909908

Authors: Fa Xing Che, Yeow Chon Ong, Wei Yu, Ling Pan, Hong Wan Ng, Gokul Kumar, Hem Takiar

Institutions: Micron (Singapore), Micron (United States)

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4408325354

FWCI:

Cites: 3

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Related to: 10