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Novel Wet-Chemical Processing for Sidewall Plating of High Reliability Bottom-Terminated Packages

Year: 2024

Type: conference-paper

Source: IEEE Electronics Packaging Technology Conference (EPTC)

DOI: 10.1109/eptc62800.2024.10909839

Authors: Arjan Hovestad, Tarun Basu

Institution: Besi (Netherlands)

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W4408325357

FWCI:

Cites: 9

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Related to: 10