Work

Development of Large RDL Interposer Package: RDL-first FOWLP and 2.5D FO-Interposer

Year: 2024

Type: conference-paper

Source: IEEE Electronics Packaging Technology Conference (EPTC)

DOI: 10.1109/eptc62800.2024.10909681

Authors: Soon Wee Ho, Soh Siew Boon, Lau Boon Long, Hsiao Hsiang-Yao, Sharon Lim Pei Siang, Vempati Srinivasa Rao

Institutions: Agency for Science, Technology and Research, Institute of Microelectronics

Language: English

Topic: 3D IC and TSV technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4408325359

FWCI: 0.806

Cites: 7

Cited by: 1

Related to: 10