Work

Improved Thermal Performance Of 3D Opto-Electronic IC Assembled on Multiple Interposers Through Design Optimization

Year: 2024

Type: conference-paper

Source: IEEE Electronics Packaging Technology Conference (EPTC)

DOI: 10.1109/eptc62800.2024.10909764

Authors: Vamsi Rekapalli, Ubed Mohammed, Pamidighantam V Ramana, Rohin Kumar Yeluripati, Jugal Kishore Bhandari, Sandhya Dharavath

Institution: UMI MajuLab

Language: English

Topic: 3D IC and TSV technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W4408325365

FWCI: 1.6

Cites: 3

Cited by: 2

Related to: 10