Work

Improved Edge Detection Algorithm for Blurred Alignment Marks in Hybrid Bonding

Year: 2024

Type: conference-paper

Source: IEEE Electronics Packaging Technology Conference (EPTC)

DOI: 10.1109/eptc62800.2024.10909953

Authors: Takamasa Sugiura, Daisuke Nagatomo, Masato Kajinami, Shinji Ueyama, Takahiro Tokumiya, Seungyeol Oh, Sungmin Ahn, Euisun Choi, Siwoong Woo, Hyunjin Lee, Byungjoon Lee, Minwoo Daniel Rhee

Institutions: Samsung (Japan), Samsung Electronics (South Korea)

Language: English

Topic: 3D IC and TSV technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4408325366

FWCI: 0.806

Cites: 8

Cited by: 1

Related to: 10