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Signal Pin Push Test Method Calibration for Soldering Interconnection Qualification in Power Packaging

Year: 2024

Type: conference-paper

Source: IEEE Electronics Packaging Technology Conference (EPTC)

DOI: 10.1109/eptc62800.2024.10909971

Authors: Yiming Liang, Qingming Feng, Haoran Wang

Institution: STMicroelectronics (China)

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W4408325370

FWCI:

Cites: 3

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Related to: 10