Work

Polymer Materials for Temporary Bonding and Laser Debonding for MEMS Based Applications: An Evaluation

Year: 2024

Type: conference-paper

Source: IEEE Electronics Packaging Technology Conference (EPTC)

DOI: 10.1109/eptc62800.2024.10909867

Authors: Sangita Chaki Roy, Srinivas Merugu

Institutions: Agency for Science, Technology and Research, Institute of Microelectronics

Language: English

Topic: Laser Material Processing Techniques

Subfield: Computational Mechanics

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4408325373

FWCI: 0.302

Cites: 9

Cited by: 1

Related to: 10