Panel Level Fine Patterning RDL Interposer Package
Year: 2024
Type: conference-paper
Authors: Jieun Park, DaHee Kim, Jaeyoung Choi, Wooseok Park, Younchan Choi, Jeongho Lee, Wonkyoung Choi, Dae-Woo Kim
Institution: Samsung Electronics (South Korea)
Language: English
Topic: 3D IC and TSV technologies
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
OpenAlex ID: W4408325398