Work

Finite Element Analysis of Interfacial Delamination in Double Side Molding Power Module SiP During Reflow

Year: 2024

Type: conference-paper

Source: IEEE Electronics Packaging Technology Conference (EPTC)

DOI: 10.1109/eptc62800.2024.10909903

Authors: Linjie Liao, Ping Wu, Yiou Qiu, Wenhui Zhu, Liancheng Wang

Institution: Central South University

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

Funders: Key Research and Development Program of Hunan Province of China, Natural Science Foundation for Distinguished Young Scholars of Hunan Province

Awards: G331538616, G7934430222

OpenAlex ID: W4408325399

FWCI:

Cites: 5

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Related to: 10